Overflow-Aware Via Placement for Dense Die-to-Die Connections in Advanced Package Routing

Hsin-Tzu Chang, Wen-Hao Liu, Iris Hui-Ru Jiang, Zi-Sheng Lin, Yueh-Hsin Tu, Bing-Xun Song

April 2025

Type

Conference paper

Publication

2025 IEEE VLSI-DAT