A 0.54pJ/b 20Gb/s Ground-Referenced Single-Ended Short-Haul Serial Link in 28nm CMOS for Advanced Packaging Applications

Laminated packages, silicon interposer substrates, and special-purpose package-
to-package interconnect, together with 3D stacking of silicon components enable systems with greatly improved computational power, memory
capacity and bandwidth. These package options offer very high-bandwidth channels
between chips on the same substrate. We employ ground-referenced single-
ended signaling, a charge-pump transmitter, and a co-designed channel to
provide communication between multiple chips on one package with high bandwidth
per pin and low energy per bit.

Authors: 
John Eyles (NVIDIA)
Steve Tell (NVIDIA)
Publication Date: 
Friday, February 1, 2013
Research Area: