A 0.54pJ/b 20Gb/s Ground-Referenced Single-Ended Short-Haul Serial Link in 28nm CMOS for Advanced Packaging Applications
Laminated packages, silicon interposer substrates, and special-purpose package- to-package interconnect, together with 3D stacking of silicon components enable systems with greatly improved computational power, memory capacity and bandwidth. These package options offer very high-bandwidth channels between chips on the same substrate. We employ ground-referenced single- ended signaling, a charge-pump transmitter, and a co-designed channel to provide communication between multiple chips on one package with high bandwidth per pin and low energy per bit.
This material is posted here with permission of the IEEE. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to firstname.lastname@example.org.