Ben Lee | Research

Ben Lee

Ben Lee joined NVIDIA Research in 2021 as a member of the Circuits Research Group with focus in photonics. He received the B.S. degree from Oklahoma State University (Stillwater, OK) in 2004, and Ph.D. degree from Columbia University (New York, NY) in 2009, both in electrical engineering. Prior to joining NVIDIA, Ben was a Research Staff Member at IBM’s T. J. Watson Research Center in Yorktown Heights, NY. His technical interests include short-reach, high-speed, and low-energy optical interconnects and integrated photonic systems. His research has resulted in over 150 peer-reviewed journal and conference publications as well as more than 20 granted US patents. He is a Senior Member of the OSA and the IEEE.

Research Area(s)

Circuits and VLSI Design

Main Field of Interest

Circuits and VLSI Design

Google Scholar

https://scholar.google.com/citations?user=JDd3O1sAAAAJ&hl=en

Publications

2026

A 32Gb/s Optical Receiver Utilizing a Differential TIA with −17.3dBm Sensitivity in a 3D-Stacked Silicon Photonics Platform

Georgios Kalogerakis, Sanquan Song, Li Xu, Nandish Mehta, Angad Rekhi, Nikola Nedovic, Ben Lee, Brian Zimmer, Stephen Tell, Yoshi Nishi, Xi Chen, Ward Lopes, Trey Greer, Tom Gray

A 0.416-pJ/b, 32-Gb/s 3D-Stacked Optical NRZ Receiver with −18.5-dBm OMA Sensitivity Using Self-Timed Decision Feedback Equalization

Li Xu, Sanquan Song, Nikola Nedovic, Georgios Kalogerakis, Nandish Mehta, Angad Rekhi, Brian Zimmer, Stephen Tell, Yoshi Nishi, Xi Chen, Ward Lopes, Ben Lee, Trey Greer, John Poulton, Tom Gray

Design and Packaging of a DWDM CW-DFB Laser Array for Co-Integrated Optical Interconnects

Nandish Mehta, Ward Lopes, Ben Lee, Tom Gray, Ryosuke Hatai

A 256 Gb/s DWDM Optical I/O in a 3D-stacked EIC/PIC Silicon Photonics Platform

Nandish Mehta, Angad Rekhi, Nikola Nedovic, Sanquan Song, Ben Lee, Georgios Kalogerakis, Li Xu, Brian Zimmer, Stephen Tell, Yoshi Nishi, Xi Chen, Ward Lopes, Trey Greer, Tom Gray

A 32 Gb/s/λ 256Gb/s/Fiber Half-Rate Bandpass-Filtered Clock-Forwarding DWDM Optical Link in a 3D-Stacked 7nm EIC/65nm PIC Technology

Sanquan Song, Nandish Mehta, Nikola Nedovic, Angad Rekhi, Georgios Kalogerakis, Li Xu, Brian Zimmer, Stephen Tell, Yoshi Nishi, Xi Chen, Ward Lopes, Ben Lee, Trey Greer, Tom Gray

2025

A Roadmap Toward Sub 1pJ/b Optical Interconnect

Shai Cohen, Ben Lee, Sanquan Song, Angad Rekhi, Peng Sun, Nandish Mehta, Nikola Nedovic, Georgios Kalogerakis, Li Xu, Trey Greer, Tom Gray

IEEE Photonics Society Summer Topicals Meeting Series

All-SMF Arrays for Co-Packaged Optics: Optimizing Cost, Complexity and Performance

Nandish Mehta, Segev Zarkovsky, Ben Lee, Raymond Chen, Shai Cohen, Liron Gantz, Tom Gray

Overcoming Challenges of Co-integrated Optics to Advance Accelerated Computing

Nandish Mehta, Ben Lee

Proc. SPIE 13372, Optical Interconnects and Packaging 2025, 1337202

2023

Beyond CPO: A Motivation and Approach for Bringing Optics onto the Silicon Interposer

Ben Lee, Nikola Nedovic, Trey Greer, Tom Gray

Journal of Lightwave Technology

2022

Photonic Circuits for Accelerated Computing Systems

European Conference on Optical Communication (ECOC), 2022

Driving Down Link Energy and Driving Up Link Density in GPU Networks

Optical Fiber Communications (OFC) Conference, 2022