In upcoming architectures that stack processor and DRAM dies, temperatures are higher because of the increased transistor density and the high inter-layer thermal resistance. However, past research has underestimated the extent of the thermal bottleneck. Recent experimental work shows that the Die-to-Die (D2D) layers hinder effective heat transfer, likely leading to the capping of core frequencies. To address this problem, in this paper, we first show how to create pillars of high thermal conduction from the processor die to the heat sink.