High-speed Low-power On-chip Global Signaling Design Overview

On-chip global signaling in modern SoCs faces significant challenges due to wire pitch scaling and increasing die size. Conventional on-chip synchronous CMOS links have already hit a performance wall in power and latency. Although approaches based on custom low-swing equalized serial-link techniques can yield improvements, strict power/silicon budgets and non-ideal in-situ conditions of large SoCs make their design much more challenging than simply transitioning off-chip signaling technologies to onchip. Therefore, a holistic approach to the on-chip global signaling problem is required. We present analyses and solutions that take into account channel design, low power transceiver circuits, clocking architectures, and power supply considerations.


John Poulton (NVIDIA)
Rizwan Bashirullah (NVIDIA)

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