John Wilson received his B.S., M.S., and Ph.D. degrees in electrical engineering from North Carolina State University (NCSU), Raleigh. He is a principal research scientist with the Circuits Research Group, NVIDIA Inc., Durham, North Carolina. From 2003 to 2006, he was a research professor at NCSU leading projects in advanced packaging, ac-coupled communication in 2.5D/3D ICs, and on-chip global signaling. From 2006 to 2012, he worked with Rambus Inc. on high-speed input–output (I/O) circuit design and methods to mitigate signal and power integrity problems in single-ended interfaces. His research interests include high-speed I/O circuit design, on-chip signaling, signal integrity, advanced packaging, and chip/package co-design. He has more than 70+ publications and 45 granted patents. He is a Senior Member of the IEEE.